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Communication

High-end FPGA devices are characterized by high performance and high power consumption, while its application also require a long lifetime and high reliability. So it brings more stringent requirements in PCB design, simulation and manufacturing. Hampoo has helped customers complete the development and manufacturing of Xilinx VirtexUl traScale+ KU9P KU11P KU13P KU15P & intel/Altera Stratix 10 GX、SX、TX、MX、400/650/850/1100 and others.

High TG Circuit Board

The customer had developed a new key piece of IP to improve data communications. As part of their product plan they had decided to work with manufacturer who could provide pcb layout and manufacturing capability and expertise that they did not have in-house.
We worked closely with the customer to guarantee that the design requirements were met; this included collaboration on the RF elements to ensure that circuit performance could be achieved while ensuring a manufacturable board stack up using FR4. Our one-stop service meant that we could quickly and easily investigate and suggest solutions that meeting the requirements.

8 layers high TG circuit board for Router
• Material:FR4 TG170
• Board Thickness:1.6mm
• Layer Count: 8 layers
• Unit Size: 27.81*25.02 MM
• Surface Finishing:ENIG
• Copper Thickness:1oz
• Line Width/Space:4/5mil
• Hole Size:0.20mm
• RoHs:Yes
• Acceptance Criteria: IPC-6012-II

INTEL_S10-1815-1900

• PCB Type: General Through-hole Board
• Material: FR-4 TG175
• Layer Count: 8 layers
• Line Width/Space: 3/4mil
• Hole Size: 0.2mm
• Min Distance: 8mil
• Hole Density: 307577/㎡
• Aspect Ratio: 8:1
• Impedance Control: 10%
• Warpage: 0.75%
• Difficulties: High layers board; 0.5mm pitch BGA; Hole to the inner line spacing is small.

Communication Board

• Material:FR4 TG170
• Board Thickness:2.4mm
• Layer Count: 10 layers
• Unit Size: 410*280mm
• Surface Finishing:ENIG
• Copper Thickness:1oz
• Line Width/Space: 6/5mil
• Hole Size: 0.25
• RoHs:Yes
• Acceptance Criteria: IPC-6012-II

ATCA Processor

ATCA Multi-core Processor Board
• ATCA Standard Board
• Dual NetLogic XLP832 Multi-core processor
• TCAM Gusset Plate of NL11K
• 40GbE QSFP, 10GbE SFP+, 100GbE, BCM5684x Exchange Chip

PCIE-X8

PCIE-X8 Data Exchange Board
• PCIE-X8 GEN 2 Standard Board with EP4S40G5H1517 as the core of the exchange chip.
• PCIE-X8 GEN 2 INTERFACE, 6 10GPBS OPTICAL INTERFACE, 4 8GPBS OPTICAL INTERFACE, 1 DDR2 storage, etc.
• Circuit board layout wiring density and PCB design is very difficult.

Mobile Board

The mobile communication board was designed, manufactured and assembly by Hampoo.
• Using ALTERA BGAEP4S40G5H40I2N
• PCB Thickness: 1.6mm
• ENIG and Bonding finger